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PWS-R (Resin bond type)
Cutting speed 2 to 10 times faster than the PWS-R type
Improvement of working conditions due to use of water soluble cutting fluid
Improvement of environment due to separate collection of chip from wastes
Various specifications available
Cutting of glass, ceramics, quartz, sapphire and other brittle materials
Cutting of silicon ingots for semiconductor devices and solar cells
Cutting of magnetic materials such as neodymium and ferrite magnets
Cutting of various ingots, SiC and substrates
Products Core Wire Dia Size Note
0.25mm 0.18mm 30 ~ 40 ㎛ Quantity of winding wire
can be adjustable